- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Wafer Bumping & WLP
- Multi-Chip Modules (MCMs)
- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
- Assembly Services
- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- MIL-STD-1553 Data Bus Couplers & Accessories
- Micro In-Line Couplers
- Tab Mounted In-Line Couplers
- Through Hole Mounted In-Line Couplers
- Box Couplers
- Custom Design Couplers
- Data Bus Coupling Transformers
- Data Bus Relays
- Data Bus Harnesses
- Bus and Stub Terminators
- Wide Bandwidth RF & Video Transformers
- Antenna Couplers
- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
STS provides a full range of mechanical testing services including mechanical shock and vibration testing. We have decades of expertise and experience in testing solder joint reliability, ball shear, die shear and pull, and wire pull. Our mechanical testing meets all ISTA standards and test procedures, ASTM standards and FedEx test procedures.
STS has invested in the ground-breaking vibration tool from Sentek Dynamics for Long Stroke Shake and Vibration testing. This electro-dynamic shaker allows for system-level vibration testing at low frequency and high amplitude with a 3” long-stroke to simulate real-world heavy environmental test conditions.
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Equipment
- Board bend test
- Shock, vibration, centrifuge
- Bond/die/lead stress analysis
Webinar - Preparing Microelectronics for Hi-Rel Applications